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  • 型 号:loctite3536
  • 规 格:30ML/支
  • 品 牌:LOCTITE
  • 单 价:100.00元/支
  • 供货总量:1000 支
  • 最小起订量:1 支
  • 有效期至:长期有效
  • 发货期限:付款之日起3天内发货
  • 最后更新:2017-06-02
  • 浏览次数:6

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产品详情

 PRODUCT DESCRIPTION
3536™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Cures rapidly at low temperatures
• Minimizes thermal stress
• Rapid device throughput
• Excellent protection for solder
joints agains mechanical stress
Cure Heat Cure
Application Underfill
Typical Assembly
Applications
Chip scale packages and BGA
3536™ epoxy reworkable underfill is designed to provide
protection for solder joints against mechanical stress such as
shock, drop and vibration.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa·s (cP):
CP52/20 1,800
Pot Life @ 25ºC, days >14
Shelf Life @ 2 to 8°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
5 minutes @ 120°C
2 minutes @ 130°C
Curing above 140°C is not recommended.
The above cure profile is a guideline recommendation. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 60 minutes @ 120ºC,
Physical Properties
Coefficient of Thermal Expansion , ppm/°C:
Below Tg 63
Above Tg 178
Glass Transition Temperature (Tg) by TMA, °C 53
Storage Modulus, GPa 3.5
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
DIRECTIONS FOR USE
1. For best results, substrate should be preheated (up to 70
°C) to allow fast capillary flow.
Removal Procedure
1. Heat the underfill approximately 240ºC using a hot air
nozzle on standard BGA rework equipment.
2. Component can be twisted and removed.
3. Clean and remove residue using a tacky flux or liquid flux
and a solder removal vacuum tool.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 to 8°C. Storage below 2°C or greater
than 8°C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

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  • 联系人:杨振   
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  • 地   区:广东 深圳市
  • 地   址:广东深圳福田爱地大厦